电子封装用diamond/Al复合材料研究进展

来源期刊:中国有色金属学报2014年第3期

论文作者:马如龙 彭超群 王日初 张 纯 解立川

文章页码:689 - 700

关键词:电子封装;Diamond/Al复合材料;热导率;热膨胀系数

Key words:electronic packaging; diamond/aluminum composites; thermal conductivity; thermal expansion coefficient

摘    要:Diamond/Al复合材料作为第四代电子封装材料,具有高热导率、低热膨胀系数和低密度等优良性能,成为研究重点。论述diamond/Al复合材料研究概况,分析挤压铸造、浸渗法和放电等离子烧结制备方法的优点和缺点,讨论热导率和热膨胀系数等热物理性能的影响因素,并对其发展前景进行展望。

Abstract: Diamond/aluminum composites, the fourth generation of electronic packaging materials, have attracted much attention for their remarkable comprehensive properties, such as high thermal conductivity, low coefficient of thermal expansion and low density. The research situation in diamond/aluminum composites was surveyed, and the advantages and disadvantages of the preparation processes that include squeeze casting, infiltration and spark plasma sintering were analyzed. Factors related to thermophysical properties, such us thermal conductivity and coefficient of thermal expansion were discussed. Finally, the relevant problems and development tendency were also addressed.

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