CAUSE OF FORMATION OF NODULAR COPPER PARTICLES ON ELECTROREFINED COPPER SUBSTRATE

来源期刊：中国有色金属学报(英文版)1994年第4期

论文作者：Lin Jianxin Li Xueliang Chen Hanhe He Jianbo Wu Jilie

文章页码：52 - 55

Key words：copper electrorefining ;nodular copper particle ;XPS ;EDAX

Abstract: The microanalysis by EDAX and XPS is used to identify elements and their valences of the initial growth sites of nodular copper particles on electrodeposited copper.Crystal orientation and the copper sheet cut out along the growth axes of nodular copper particles are also studied by EDAX and XPS.It shows that the adhesion of some suspended slime, such as copper and silver corpuscles, oxides of arsenic,antimony,bismuth and copper, sulfides of copper, makes crystal face(220) be preferred orientation and cause the growth of nodular copper particles. Nonconductor corpuscles such as silicates,calcium and magnesium sulphates would not produce nodulation and are occluded in electrodeposited copper.